Laser precision and accuracy to drive innovation and optimize production.
Innovation continues to drive the market for technology products. Whether it involves mobile devices, wearables, Internet of Things devices or any of the myriad other electronic products in our pockets, on our wrists and in our homes, the primary challenges faced by manufacturers are related to the processing of materials and components at an ever-smaller scale and at higher levels of precision. The modern electronic components that are the building blocks of modern technology products, along with the cases and housings that comprise their form factor, need to keep pace with this requirement for smaller size and higher precision in order to stay competitive.
For component manufacturers that means continually evolving their processing capabilities to address challenges driven by smaller die sizes, higher interconnect density, tighter line spacing and new materials. For micromanufacturers it means not only formulating effective strategies for precise and accurate processing at very small sizes, but also for addressing a wider range of material types to meet stringent requirement for form factor, including tighter tolerances and higher quality fit & finish.
ESI’s decades of applied laser expertise and our focus on precision and accuracy helps our customers meet the challenges posed by small size and new materials. ESI’s laser-based manufacturing systems employ a patented Third Dynamics™ processing methodology. Coordinating a combination of nine control elements, Third Dynamics™ allows ESI systems to machine, mark, singulate and drill to your most exacting specifications. This precision and accuracy continues to be a driving force in the worldwide adoption of ESI systems. For example, each of the world’s top 10 flexible circuit manufacturers trust ESI with their bare board via drilling production.
Find out more about what sets ESI apart...
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.