CornerStone offers industry-leading via placement accuracy, and can be extended for even smaller and denser via requirements in the future.

Precision laser microvia drilling solutions for IC packaging.

Incorporating ESI’s patented Third Dynamics beam positioning technology in a multi-beam format, CornerStone provides per-beam drill rates that significantly outperform other high-volume manufacturing laser drilling systems. The resulting productivity leads the industry and in turn significantly lowers customers' cost of ownership.

CIRCUIT PACKAGING PRODUCTS


Accuracy and throughput in a laser microvia drilling system.

CornerStone helps circuit packaging manufacturers meet the microvia drilling demands of processing next-generation products. With its unique combination of high-accuracy microvia formation, high-volume throughput capabilities and an industry-leading footprint size, CornerStone allows integrated circuit manufacturers to easily address a wide range of IC packaging design requirements and drill smaller vias at a low total cost of ownership.

Incorporating ESI’s patented Third Dynamics beam positioning technology in a multi-beam format, CornerStone provides per-beam via drilling rates that significantly outperform other high-volume manufacturing laser via drilling systems. The resulting productivity leads the PCB laser processing industry and significantly lowers PCB manufacturing customers' cost of ownership.

As next-generation substrates push the requirements for line space and signal routing, target pad and via diameters necessarily decrease, requiring a commensurate improvement in via drilling placement accuracy. CornerStone offers industry-leading via drilling placement accuracy, and can be extended for even smaller and denser via drilling requirements in the future.

CornerStone has an overall footprint that is 25 percent smaller than typical laser via drills, helping to deliver significant productivity increases and substantial savings for PCB laser processing customers, as they extend their via drilling production lines for additional PCB laser processing capacity.

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APPLICATIONS:
  • IC Packaging (FC-BGA and FC-CSP)
MATERIALS:
  • Filled resin such as ABF

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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