Incorporate leading-edge processing techniques into your production operation.
Stay competitive and meet the rapidly evolving processing challenges related to decreasing size, use of next-generation materials and thin wafers.
ESI’s wafer scribing system offers an alternative that relies on ESI’s advanced ultrafast laser technology to provide HVM-oriented semiconductor manufacturers the ability to effectively process wafers based on a wider range of materials.
Unlike processing solutions that rely on nanosecond laser scribing/grooving, Ultrus applies ultrafast high-pulse-rate laser processing technology that enables chip manufacturers to incorporate leading-edge processing techniques into their production operation, while maintaining high die break strength and minimizing heat affected zones. This allows wafer manufacturers to more precisely remove metal layers and fragile materials from dicing streets from a wider range of materials without damaging the underlying device. Resulting in higher production quality, leading to higher backend yields, and the ability to process both current and next-generation materials at high-volume throughput and at a significantly lower total cost of ownership.
SCRIBING / GROOVING PRODUCTS
Ultrafast laser scribing solution for next-generation low-K materials and thin wafers.
The Ultrus wafer grooving solution enables semiconductor manufacturers to optimize their production capabilities and meet production challenges related to processing current and next-generation materials and thin wafers. Ultrus systems apply ultrafast high-pulse-rate laser processing technology to easily integrate new materials into the wafer processing workflow.
Ultrus delivers a low cost-of-ownership solution for the combined challenges of newer materials and thin wafers, and the need to maintain high-volume production throughput.
The ultrafast laser technology employed in Ultrus enables chip manufacturers to incorporate leading-edge processing techniques into their production operation, and still maintain high die break strength and minimize heat affected zones. Allowing for more precise removal of metal layers and fragile materials from dicing streets from a wider range of materials—without damaging the underlying device. The result is higher production quality and higher backend yields.
- Laser Grooving/Scribe
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.