Process a wide range of current and new materials.
The adoption of more fragile materials has presented semiconductor manufacturers with processing challenges related to maintaining high throughput at high accuracy while minimizing the risk of damage to the material — and thereby decreasing yields. Using ultrafast, high-pulse-rate laser technology, ESI’s laser processing systems enable semiconductor manufacturers to maintain higher yields while enjoying a lower total cost of ownership.
Memory Repair Solutions
ESI continues to push boundaries with semiconductor laser fuse processing - memory repair. Our world-class production systems use precise laser energy in the production of next-generation devices for DRAM, SRAM, embedded memory and other laser-fuse applications.
- Repair costs below one half of one percent of overall die costs.
- Apply ultra-small spot size.
- Accuracy driven by state-of-the-art laser positioning.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.