An advanced laser platform for high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.

Wafer trimming Solution

ESI’s Wafer Trimming system enables customers in the mobile communications market to optimize the performance of their circuits and achieve tighter resistor tolerances.

WAFER TRIMMING SOLUTIONS


The M350 maximizes throughput without sacrificing quality.

An advanced new platform for high precision, high throughput wafer-level optimization of linear and mixed signal IC devices.

  • Next generation version of our field-proven WaferTrim™ technology.
  • Fully integrated state-of-the-art laser trimmer and wafer prober system.
  • Seamless integration to today’s ATEs via GSI Group’s Enhanced Tester Interface software and real-time tester interface hardware.
  • Proven superior laser control ensures process consistency & highest yields
  • Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
  • New user-friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup files.
  • Optional Lasers – Short (SP) & Long (LP) Pulse Duration.

learn more about the M350

APPLICATIONS:
  • Trimming components on wafer substrate
MATERIALS:
  • Thin film
  • Thick film

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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