ESI’s market-leading laser trimming solutions for thick film chip-R. Incorporating decades of
applied laser expertise.


Laser Trimming

Our laser trimming products provide the industry with the most flexible laser processing solutions available.

These systems precisely scribe, or adjust the parameters of, individual components by using a laser beam to remove exact amounts of material. The tools’ combination of parts handling, measurement sub-systems, and pattern recognition deliver higher yields and increased throughput — ultimately improving your bottom line.

Our superior laser trimming solutions are being employed by customers world-wide, including leading laser processing companies such as Applied Laser Technology, Inc.

RESISTOR TRIMMING SOLUTIONS


An advanced platform for trim and test of thick film circuits, hybrids and components including PCBs and SMT.

Measurement platform supports passive and active trim applications

  • Traceable measurement certification
  • Resistance range from 5 milli-Ohms to 1 Gig Ohm
  • DC Voltage measurement and sourcing
  • VXI and GPIB architecture for 3rd party expandability

Patented beam calibration and vision system hardware for precise laser positioning.

Latest generation diode-pumped laser technology for minimum maintenance, long term stability and high reliability.

VersiTrim 2™ Software

  • Graphical user interface for simple job creation and operation
  • Tool library for fast job setup
  • Comprehension software API library for advanced applications and custom integration

learn more about the LT2200

APPLICATIONS:
  • Thin film resistor trimming
MATERIALS:
  • Thick Film

A versatile platform for trim and test of thin film resistors, resistor networks, hybrids, temperature sensitive devices (RTDs) and other thin film - small geometry applications.

  • Choice of 8 or 15 μm spot size using Green (532nm) laser technology.
  • Programmable Z stage with 4 μm resolution for optimum focus control.
  • Patented beam calibration and vision system hardware for precise laser positioning.
  • Latest generation diode-pumped laser technology for minimum maintenance, long term stability and high reliability.
  • Measurement platform supports passive and active trim applications
    • Traceable measurement certification
    • Resistance range from 5 milli-Ohms to 1 Gig Ohm
  • VersiTrim™ Software – Graphical user interface for simple job creation and operation

The LT2210 uses ESI’s Third Dynamics algorithm, which delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT2210 utilizes the same resistor trimming platform for a wide range of production applications,  customers experience a lower total cost of ownership.

learn more about the LT2210

APPLICATIONS:
  • Strain gauges
  • Fuel gauges
  • Rotary encoders
  • Pressure sensors
  • Thermistors
  • Temperature Sensors
  • Gearbox controllers
  • Vehicle emission detectors
  • Chip resistors
MATERIALS:
  • Thin film

A high performance chip trim system designed specifically for thick film components down to the latest 01005 products.

  • Spot size down to 20 microns
  • Diode-pumped laser technology for minimum maintenance, long term stability and high reliability
  • Patented beam calibration and vision system for automatic alignment and precise laser positioning
  • High speed handler manages thin substrates used with the latest generation small geometry chip resistors
  • Wide range measurement system
    • 5 milli-Ohms to 1 Gig Ohm
    • Traceable measurement certification
  • ChipTrim™ Software
    • Graphical user environment dedicated to chip trimming
    • Globalized language support

The LT3100 uses ESI’s Third Dynamics algorithm, which delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT3100 utilizes the same resistor trimming platform for a wide range of production applications,  customers experience a lower total cost of ownership.

learn more about the LT3100

APPLICATIONS:
  • Strain gauges
  • Fuel gauges
  • Rotary encoders
  • Pressure sensors
  • Thermistors
  • Temperature Sensors
  • Gearbox controllers
  • Vehicle emission detectors
  • Chip resistors
MATERIALS:
  • Thin film resistors

A high performance chip trim system designed specifically for thick and thin film components down to the latest 01005 products.

  • Spot size down to 8 microns
  • Patented 532 nm diode-pumped laser technology for minimum maintenance, long term stability and high reliability
  • Patented beam calibration and vision system for automatic alignment and precise laser positioning
  • High speed handler manages thin substrates used with the latest generation small geometry chip resistors
  • Wide range measurement system
    • 5 milli-Ohms to 1 Gig Ohm
    • Traceable measurement certification
  • ChipTrim™ Software
    • Graphical user environment dedicated to chip trimming
    • Globalized language support

The LT3110 uses ESI’s Third Dynamics algorithm, which delivers significantly higher beam control accuracy at a higher level of precision without sacrificing throughput. Since the LT3110 utilizes the same resistor trimming platform for a wide range of production applications,  customers experience a lower total cost of ownership.

learn more about the LT3110

APPLICATIONS:
  • Strain gauges
  • Fuel gauges
  • Rotary encoders
  • Pressure sensors
  • Thermistors
  • Temperature Sensors
  • Gearbox controllers
  • Vehicle emission detectors
  • Chip resistors
MATERIALS:
  • Thick film resistors

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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