Today's consumer electronic market is driving the connected world with over 5 billion phones, 2 billion smartphones, 1.5 billion tablets and 8.5 billion IoT devices. These devices are driven by technology as users demand smaller size, crisper screens, better cameras, faster speeds and the latest 5G connectivity. As consumer's demand new features the manufacturing requires new capabilities, faster production times and decreasing costs from their component supply chain. Laser tools are helping to provide the consumer electronic component manufactures with the technology to meet the new demands.
Success has become more dependent on the ability to react quickly, produce a high volume number of precision components on tight timelines at the lowest price to their brand customer. ESI’s portfolio of adaptable laser micromachining systems is engineered like no other to deliver maximized yield at an unmatched value per photon. Now you can provide advanced components with increased precision and speed in a high production environment.
See how ESI can solve your consumer electronic component production challenges:
|5G||Connectivity||Laser Via Drilling|
|Design form factors||Aesthetics/Usability||
|High yield manufacturing||Functionality||
CONSUMER ELECTRONIC COMPONENT SOLUTIONS
Apply unique engineering expertise to transform large format material.
The Garnet micromachining platform is ESI’s low cost of ownership platform built in China for fast delivery to Chinese manufacturing. Optimized to deliver high volume production throughput for laser drilling on large format materials at the highest accuracy of a mid range laser on a 300x300mm stage. The platform takes advantage of ESI’s built-in-design extendibility for multiple lasers, optics and stage configurations to meet the short ramp time needed to build your next device.
The Garnet can be easily configured to accommodate a wide variety of laser sources with different powers, wavelengths and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.
- Stainless Steel
ESI’s most powerful laser tool for PCB cutting
The Garnet Depaneling-20 is ESI’s most powerful laser tool designed for flexible and rigid PCB cutting applications. Built in China for fast delivery to Chinese manufacturing. Optimized for precision and high production throughput to maximize your production cycle over the market's less reliable laser tools that require frequent calibration and maintenance to remain operational in production environments. Now you can meet yield requirements, reduce overall production costs and build for future production opportunities with a single tool that is engineered to eliminate constant callibaration and built to provide consistent up time.
- 40 Khz-300KHZ (20w)
- 300 x 300 mm
- Single fixture processing
The Flex5335 processes the thinnest flex materials with high precision.
The Flex5335 shares technology and application advantages with the rest of the 5335 family of FPC laser processing systems. It differentiates itself by incorporating proven UV laser technology with the versatility of beam shaping technology to allow manufacturers to more precisely and efficiently process unclad organic materials.
- Coverlay routing
- Solder-mask opening
- Liquid Crystal Polymer (LCP)
- Coverlay (Polyimide + Adhesive)
- Other unclad flex circuit materials
- Solder mask
Let us show you how laser micromachining transforms materials beyond the limits of mechanical tools.