ESI has the right solution for your PCB flex laser processing needs.
When it comes to flex via drilling for PCB, ESI has a wide range of solutions. As a leading supplier of flex via drilling equipment, ESI applies our decades of laser-material interaction expertise to offer the flex via drilling systems that will address your most demanding applications.
ESI has over 15 years of experience in developing UV via drilling systems. From building the systems to developing the application solutions, ESI provides the most popular via drilling solutions on the market, and at a competitive price point.
All ESI flex PCB via drilling machines include a standard 12-month warranty, application training for manufacturing operators, and a number of automation options.
FLEX PCB LASER PROCESSING PLATFORMS
High quality and high speed that translates to breakthrough productivity.
The CapStone™ system incorporates new laser technology and new laser control capabilities to deliver a high-throughput solution. CapStone addresses an evolving set of production challenges faced by leading FPC processors to enable higher levels of precision–even on thinner materials.
APPLICATIONS:
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Patterning
- Skiving
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid crystal polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT duroid)
- Coverlay (polyimide + adhesive)
Increase CapStone™'s Yield Performance
CapStone's SPOT ON™ Feature Upgrade increases system uptime through early warning of spot quality deviation and increases the CapStone™'s yield performance by reducing leading causes of via quality degradation.
MAZIMIZE YIELD WITH FOCUS CALIBRATION & ACCURACY:
- Automatic Calibration
- Optical method
- Accurate to ~10um
- Process Window is automatically centered
- Maintain ideal focus position to within <30um across the work surface
APPLICATIONS:
- Blind Vias
- Through Hole Vias
The perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers.
The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.
APPLICATIONS:
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Patterning
- Skiving
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
LodeStone Laser Processing System
The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.
APPLICATIONS:
- Flex and interconnect processing
- FPC depaneling
- Coverlay routing
- Touchscreen and polarizer cutting
- Through via drilling (THV)
MATERIALS:
- Polyimide (PI)
- Liquid Crystal Polymer (LCP)
- Cyclo-Olefin Polymer (COP)
- Polyethylene terephthalate (PET)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
RedStone Flex PCB Laser Processing System
RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.
APPLICATIONS:
- Flex and interconnect processing
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
Higher throughput. Industry-leading power monitoring and control. ESI quality.
Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology. With the added assurance of energy traceability and closed-loop power control that Precision Pulse™ provides, RedStone XP is a low-risk investment.
MARKETS:
- Flex PCB Laser Processing
- Rigid-Flex Laser Processing
- Laser Micromachining
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
APPLICATIONS:
- Through via drilling (THV)
- Flex and interconnect processing
- Blind via drilling (BHV)
- Routing
- Coverlay routing
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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