Reliability. Accuracy. Ease-of-use. All at a low cost of ownership.

RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

Rest assured that your RedStone™ system will stay productive with high uptime. RedStone™ shares over 90% of components in common with the flagship ESI Models 5335™ and GemStone™ that are in high-volume 24/7 production at the world’s top 10 flex circuit manufacturers.

RedStone is the ideal system for processing applications that can be developed with large process windows. Large process window applications examples include through-cut routing, through via applications, and removing easily-ablated materials from a durable substrate. Applications such as these can best utilize RedStone’s high accuracy, high throughput capabilities while ensuring high process yield.

OVERVIEW


Laser via drilling and precision laser micromachining

MARKETS:
  • Flex PCB Laser Processing
  • Rigid-Flex Laser Processing
  • Laser Micromachining
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)
APPLICATIONS:
  • Flex and interconnect processing
  • Through via drilling (THV)
  • Routing
  • Coverlay routing

SPECIFICATIONS


Easily address most flex and rigid-flex PCB processing needs

LASER:
  • Nanosecond UV – 6W
  • Nanosecond UV – 15W
MATERIAL HANDLING:
  • Vacuum chuck - 533mm x 635mm (±20um accuracy)
  • Electrical and software interface for web and panel handler integration

FEATURES & OPTIONS


Engineered for production-oriented flex PCB laser processing

  • ESI-patented compound beam positioning technology
  • Automated vision system for alignment and scaling compensation
  • Easy-to-use Windows 7 interface
  • Multi-language operator user interface
  • Sophisticated process development functionality
  • Comprehensive logging and diagnostics functionality

As the recognized leader in flex PCB processing, ESI has decades of applied expertise in laser via drilling and production-oriented Flex PCB laser processing. Learn more about ESI’s portfolio of laser via drilling systems and see how you can incorporate flex PCB laser processing to help address flex PCB manufacturing challenges.

Let ESI help fuel your drive for innovation – contact an ESI Representative today.