Laser via drilling system for flex PCB manufacturing. Best-in-class high-volume FPC laser drilling machine for flexible PCB Manufacturing.


Via drilling for flex PCB laser processing. ESI 5335.

The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

Utilizing ESI’s Third Dynamics™ technology, the 5335 delivers industry-leading capabilities for UV laser via drilling and is optimized for processing both flexible circuits and rigid-flexible printed circuit boards. It also addresses other high-accuracy laser processing applications such as routing, patterning, and skiving through a combination of ESI's patented compound beam positioning and solid-state optical technology.

The Model 5335’s low cost of ownership—along with its high-volume laser manufacturing focus—optimizes your laser processing and production capabilities and puts you in a better position to keep up with the increasingly demanding needs of industries such as consumer electronics, automotive and medical devices.

OVERVIEW


Laser via drilling and precision laser micromachining

MARKETS:
  • Flex PCB Laser Processing
  • Rigid-Flex Laser Processing
  • Laser micromachining
APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

SPECIFICATIONS


High productivity laser via drilling and laser micromanufacturing

LASER:
  • Nanosecond UV Nd:YAG - 11 W
MATERIAL HANDLING:
  • Vacuum chuck - 533mm x 635mm (±20um accuracy)
  • Electrical and software interface for web and panel handler integration

FEATURES & OPTIONS


A range of systems for a range of challenges

  • Third Dynamics™ beam positioning
  • Precision Pulse™ digital power control
  • Automated vision system for alignment and scaling compensation
  • Easy-to-use Windows 7 interface
  • Multi-language operator user interface
  • Sophisticated process development functionality
  • Comprehensive logging and diagnostics functionality

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today