Flex PCB laser processing for a wide range of materials and applications. The industry-leading solutions for flex via drilling.

Leading-edge solutions for flex via drilling.

The demand for ever-smaller microvias and higher feature density in increasingly delicate flexible and rigid-flex circuits is driving increased worldwide adoption of ESI systems. Nine of the world’s top 10 flexible circuit manufacturers trust ESI with their bare board production. Among laser drilling machine manufacturers, ESI designs via drilling systems that excel in accuracy, power control, reliability, and productivity to achieve lower overall cost of ownership for applications ranging from the most simple coverlay cutting to today’s most advanced microvia drilling and circuit patterning processes. This makes ESI the clear industry choice.

FLEX INTERCONNECT PLATFORMS


GemStone is the elite flex PCB laser with increased via performance and accuracy.

GemStone is designed to provide leading-edge PCB manufacturers with a high-throughput solution for efficiently processing flexible circuit interconnects on thinner and lighter materials. This enables flex PCB processors to extend their services and cost-effectively address the broader set of market requirements associated with high-volume flex processing.

learn more about GemStone

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Coverlay (Polyimide + Adhesive)

The 5335 is able to handle the finest materials with optimal production speeds and quality.

5335 is a great choice if you are looking for improved quality microvias and throughput. The 5335 also has the diode pumped, repetitively Q-switched solid state laser which provides high productivity and quality vias coupled with the fifth generation beam positioner. The 5335 is used by the top ten PCB manufacturing companies due to the precision and production rates.

 

learn more about 5335

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

The Flex5335 processes the thinnest flex materials with high precision.

The Flex5335 shares technology and application advantages with the rest of the 5335 family of FPC laser processing systems. It differentiates itself by incorporating proven UV laser technology with the versatility of beam shaping technology to allow manufacturers to more precisely and efficiently process unclad organic materials.

learn more about Flex5335

APPLICATIONS:
  • Coverlay routing
  • Solder-mask opening
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Coverlay (Polyimide + Adhesive)
  • Other unclad flex circuit materials
  • Solder mask

Model 5335xi processes via drilling for most flex and rigid-flex PCB needs.

The 5335xi has a low cost of ownership and addresses most flex and rigid-flex PCB processing needs.  The 5335xi also has the diode pumped, repetitively Q-switched solid state laser which provides high productivity with excellent vias.

Some of the 5335xi highlights are:

  • ESI’s fourth-generation beam positioner.
  • Peak point-to-point move speed is 2,000 points per second.
  • 18,000 vias per minute.
  • Vias as small as 25 microns.

learn more about the 5335xi

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

LodeStone Laser Processing System

The LodeStone system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.

learn more about LodeStone

APPLICATIONS:
  • Flex and interconnect processing
  • FPC depaneling
  • Coverlay routing
  • Touchscreen and polarizer cutting
  • Through via drilling (THV)
MATERIALS:
  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Cyclo-Olefin Polymer (COP)
  • Polyethylene terephthalate (PET)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today