Provide all the compatibility you need for automated 300 mm production.

SC300 — Track wafers through the manufacturing process.

The SC300 uses laser technology to place permanent, highly-readable marks on wafers to allow for traceability through the semiconductor processes. The system provides the compatibility, cleanliness levels, mark quality, and reliability required to support high-volume 300 mm production.

SUMMARY

Debris-free wafer marking for production-level manufacturing automation.

MARKETS:
  • Semiconductor Foundries
  • FPGA Manufacturers
  • DRAM Manufacturers
  • SSD Manufacturers
  • OSATs
APPLICATIONS:
  • Wafer marking
MATERIALS:
  • Silicon

SPECIFICATIONS

Provide wafer traceability throughout the manufacturing process.

LASER:
  • Type: Acousto-optic Q-switched, TEM00 Nd:YLF diode-pumped laser
  • Wavelength: 1053 nm
  • Pulse to Pulse Stability: <0.5% at 1 kHz
  • Optics: Flat field focusing lens
  • Spot Size: 50, 60, or 70 μm
  • Depth: 2.5 to 5.0 μm
MATERIAL HANDLING:
  • Wafer Size: 300mm micromachining
  • 200mm bridge capability (optional)
  • Alignment: Optical high resolution wafer aligner
  • Wafer Transport: Pick & place robot arm with single end effector
  • I/O Ports: Two fixed FOUP carrier load ports

FEATURES & OPTIONS

  • Marking Modes: Dot matrix mode (straight line or arc marking)
  • SuperSoftMark® Process
  • Debris Free: 0.02 particles/cm, 0.17 particle size measured over 5mm area

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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