Provides all the compatibility you need for automated wafer production.
Wafer Marking
WaferMark® series laser systems from ESI are the recognized industry leaders for wafer marking applications. We have WaferMark solutions for the two most important reasons why you mark wafers and die — traceability and product identification.
The world’s silicon suppliers, wafer reclaim, and semiconductor manufacturers consistently come to us for unsurpassed mark quality with our hardmark and patented SuperSoftMark® processes.
WAFER MARKING PLATFORMS
SC300 — Track wafers through the manufacturing process.
The SC300 uses laser technology to place permanent, highly-readable marks on wafers to allow for traceability through the semiconductor processes. The system provides the compatibility, cleanliness levels, mark quality, and reliability required to support high-volume 300 mm production.
APPLICATIONS:
- Soft Mark Wafer Marking
MATERIALS:
- Silicon
SigmaDSC — 100mm to 200mm Automated Wafer Marking System
The SigmaDSC is based on continual innovation in marking solutions for new substrate materials, highest quality marks and factory automation, using laser technology to place permanent, highly-readable marks on wafers to allow traceability of the wafers through each step in the semiconductor manufacturing process. The SigmaDSC system provides the compatibility, cleanliness levels, mark quality, and reliability required to support high-volume 100mm to 200mm production.
The hard mark process was developed for marking as cut wafers such that the marks will survive subsequent lapping and wafer thinning processes.
The key to the SigmaDSC’s uniform dot depth and roundness is ESI’s precise pulse to pulse stability combined with sufficient power.
APPLICATIONS:
- Hard Mark Wafer Marking
MATERIALS:
- Silicon
HM300 — Hard marking 300mm wafers
The HM300 is the industry-leading solution for SEMI-standard compliant hard marking on semiconductor wafers. ESI's control software enables the user to manage much of the system's functionality. HM300's programmable depth control allows for adjusting marking depth, up to 100 µm.
APPLICATIONS:
- Hard Mark Wafer Marking
MATERIALS:
- Silicon
SigmaClean — Soft marking 100-200mm wafers
SigmaClean’s Class 1 cleanroom compatibility and ultra-stable patented diode-pumped laser has helped to make it the industry-leading solution for cost-efficient, highly-readable soft marking of 100 mm to 200 mm wafers for identification and traceability. SigmaClean can place multiple mark groups at any orientation on the wafer surface, within a 25mm band around the wafer’s circumference.
APPLICATIONS:
- Soft Mark Wafer Marking
MATERIALS:
- Silicon
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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