Maintain high die-break strength and minimize heat-affected zones to deliver production throughput without risk of damage to the underlying device.

Laser Scribing/Grooving

ESI’s laser scribing solution provides semiconductor manufacturers with a laser-based alternative to mechanical processing that increases back end yields and reduces the risk of damaging the underlying devices. Ultrus’ ultrafast high-pulse-rate lasers and proprietary beam positioning technology makes it possible to precisely process thinner and more fragile materials at a high level of accuracy and at higher throughput speeds. Since Ultrus allows for higher die break strength (DBS) and a smaller heat affected zone (HAZ), semiconductor manufacturers can effectively meet the challenges related to processing thin wafers and the new low-k materials — as well as the current materials — without compromising on yields.

SCRIBING/GROOVING PLATFORMS


Ultrafast laser scribing solution for next-generation low-K materials and thin wafers.

The Ultrus wafer grooving solution enables semiconductor manufacturers to optimize their production capabilities and meet production challenges related to processing current and next-generation materials and thin wafers. Ultrus systems apply ultrafast high-pulse-rate laser processing technology to easily integrate new materials into the wafer processing workflow.

Ultrus delivers a low cost-of-ownership solution for the combined challenges of newer materials and thin wafers, and the need to maintain high-volume production throughput. 

The ultrafast laser technology employed in Ultrus enables chip manufacturers to incorporate leading-edge processing techniques into their production operation, and still maintain high die break strength and minimize heat affected zones. Allowing for more precise removal of metal layers and fragile materials from dicing streets from a wider range of materials—without damaging the underlying device. The result is higher production quality and higher backend yields.

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APPLICATIONS:
  • Laser Grooving/Scribe
MATERIALS:
  • Silicon

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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