Innovation Delivered

Optimized for productivity
Built for the lowest cost of ownership
Designed for the most advanced materials

The world’s most advanced ABF via drilling system

CO2 Laser System for High Precision and High-Speed ABF IC Substrate Manufacturing. Geode’s technology enables a greener manufacturing solution through 21% less floor space 72% less weight and up to 65% less power consumption than the competition.

 

Geode™ A Laser Drill Features

 

Throughput

HyperSonixTM
MKS expertise with acousto-optic devices (AOD) enables sound waves to modify laser energy for optimum throughput.



AcceleDrillTM
Geode uses AODs for spatial energy distribution and beam steering to maximize applications flexibility.

Accuracy

VDCTM
Via Density Compensation improves via diameter stability, accuracy and throughput.

 


BCT
The MKS beam characterization
tool offers precision in-line laser/
optical evaluation and control for
improved calibration and via
consistency.

Footprint

LiteDesignTM
Compact and lightweight system architecture allows for more installation flexibility and reduces production footprint.



UpTimeTM
Compact and lightweight system architecture allows for more installation flexibility and reduces production footprint.

SUMMARY

CO2 Laser System for High Precision and High-Speed ABF IC Substrate Manufacturing

MARKETS:
  • Cloud Computing
  • Communications
  • High Performance Computing (HPC)
  • Semiconductor
  • AI processing
APPLICATIONS:
  • Advanced HDI PCB
  • IC Packaging
  • IC Substrate
MATERIALS:
  • ABF
  • EMC
  • Non CU-Clad Dielectric, RCC

SPECIFICATIONS

Highest Throughput. Greenest Footprint. Most Flexibility

LASER SPECIFICATION:
  • Peak Power 100W
  • Laser Pulse Frequency 200kHz (No rep rate)
  • Average Power >250W
SYSTEM:
  • Target Applications: FCBGA-IC Substrate
  • Target Via Range: 30-85um
  • Total System Accuracy: <7um |M| + 4σ
  • Scan Area: 12mm x 6mm
  • Panel Size Range: 16”x20” to 22.05”x24.5”
  • Panel Thickness Range: 50um-3000um
  • Processing: LDD Conformal Mask
  • Energy Monitoring: Real time pulse energy & monitoring (programmable alarm settings)
  • Special Features: Beam Characterization Tool, Temperature Control Unit
  • Panel Height Detection: Touchdown sensor (calibrated to align with camera focus), Z-Mapping
MATERIAL HANDLING:
  • Panel Processing: Dual-head two panel system
  • Available Load/Unload Automation: Standard, Standard with NG Function, Panel Flipper with NG Function
  • Automation Accuracy (panel to chuck): 500um