High-volume manufacturing of HDI PCBs requires blind (BHV) and through-hole (LTH) via processing; these vias are typically created with laser drills, which offer fast, reliable, and cost-effective processing at a miniaturized scale. ESI’s HDI systems enable HDI manufacturers to drill vias in a broad range of copper-clad base materials such as glass-woven reinforced epoxy resins (FR4) or other specialty materials. For PCB manufacturers of HDI boards, CO2 laser processing is the optimal choice for overall lower cost of ownership. ESI leverages our expertise in laser processing and our proven track record of success in laser-based systems — especially in the flexible PCB manufacturing segment, where ESI is the clear market leader — and applies it to the HDI manufacturing segment. Our solutions are engineered to provide great reliability at high-quality output with the industry’s lowest cost of ownership, and backed by ESI’s professional service and support organization with local offices through the world.
HIGH DENSITY INTERCONNECT PLATFORMS
CO2 via drilling for HDI PCB manufacturing.
Take advantage of a powerful new CO2 laser and a new set of control capabilities that leverage ESI’s decades of laser-material interaction experience and application expertise to help you innovate and stay ahead.
GeodeTM is ESI’s most advanced HDI microvia drilling solution for precision processing of a wide range of applications. Geode’s compact and lightweight system architecture allows for more flexibility in system placement and use on production floor.
- PCB Manufacturing
- Integrated circuit packaging
- Substrate processing
- System level packaging
Affordable versatility in CO2 laser via drilling for HDI applications.
nViant provides a CO2-based laser microvia drilling solution with a unique combination of high-quality via formation and high-accuracy, in a robust via drilling system that delivers high-volume laser processing throughput at a competitive price point. Maintain your PCB laser processing production throughput for HDI applications without sacrificing quality or accuracy.
The nViant via drilling system precisely drills blind (BHV) and through-hole vias (LTH) in coppercladded, glass woven reinforced materials (FR-4) at a typical range of 40 to 300µm, and enables pcb laser processing customers to Include rigid HDI processing as part of a broader portfolio of services and at a lower cost of ownership, while leveraging the experience of a laser systems provider that has a demonstrated history of applied laser expertise.
- HDI PCB via drilling
- Substrate Processing
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.