An advanced laser platform for high precision, high-throughput wafer-level optimization of linear and mixed-signal IC devices.

WaferTrim M350 maximizes throughput without sacrificing quaility.

  • Next generation version of our field-proven WaferTrim™ technology.
  • Fully integrated state-of-the-art laser trimmer and wafer prober system.
  • Seamless integration to today’s ATEs via GSI Group’s Enhanced Tester Interface software and real-time tester interface hardware.
  • Proven superior laser control ensures process consistency & highest yields.
  • Advanced vision and motion subsystems provide dramatically improved positioning and alignment capability.
  • New user friendly WaferTrim™ software improves efficiency and provides compatibility with existing M310 data setup files.
  • Optional Lasers – Short (SP) & Long (LP) Pulse Duration


High throughput, high precision.

  • Wavelength: 1.064 μm
  • Energy: >3.0μJ @ 6.5μm spot size
  • Energy Stability: 3.0% RMS
  • Pulse Duration: 8ns (SP) or 50ns (LP)
  • Closed Loop X, Y, Z, Theta stage
  • X-Y Resolution: 0.02μm
  • X-Y Accuracy: ± 2μm
  • Z Range: 10mm (0.39”)
  • Z Resolution: 0.13μm
  • Theta Range: ± 5°
  • Theta Resolution: 1.4μrad
  • Chuck Size: Supports 100-200mm wafers
  • Chuck Material: Choice of Al, Ni or Au finish


Precision alignment and beam positioning.

  • Optional Equipment:
  • Wafer Handler
  • 3-axis servo-controlled robot and pre-aligner
  • Capacity: Up to 50 wafers (two cassettes)
  • Control: Manual or Automatic for unattended operation
  • Wafer Support: 100mm - 200mm wafers with ability to process partial wafers
  • Mapping End Effector
  • Detects presence, absence or cross-slotted for all wafer and substrate types
  • OCR and Barcode Reader
  • SEMI character font with checksum and barcode
  • Light Tower
  • Tape/Film Frame Option
  • Probes Cleaning Option
  • Probe Vision Option
  • High and low mag viewing of probe pins
  • Hot Chuck
  • Galvanometer-based, stationary optics
  • Positioning Accuracy: Better than ± 1μm
  • Positioning Resolution: < 0.06μm
  • Beam Field Size: 10mm x 10mm square field (14mm diameter)
  • Min Spot Size: 6.5 - 12μm, 5μm optional
  • Depth of Focus: ±12μm at 6.5μm spot
  • On-Chuck Power control calibration

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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