ESI’s market-leading CircuitTrim® solutions for thick film chip-R. Incorporating decades of applied laser expertise.

An advanced platform for trim and test of thick film circuits, hybrids and components including PCBs and SMT.

Measurement platform supports passive and active trim applications

  • Traceable measurement certification
  • Resistance range from 5 milli-Ohms to 1 Gig Ohm
  • DC Voltage measurement and sourcing
  • VXI and GPIB architecture for 3rd party expandability

Patented beam calibration and vision system hardware for precise laser positioning.

Latest generation diode-pumped laser technology for minimum maintenance, long term stability and high reliability.

VersiTrim 2™ Software

  • Graphical user interface for simple job creation and operation
  • Tool library for fast job setup
  • Comprehension software API library for advanced applications and custom integration

OVERVIEW


Receive high beam control accuracy and a high level of precision without sacrificing throughput.

MARKETS:
  • Automotive
  • Medical
  • Aerospace
APPLICATIONS:
  • Strain gauges
  • Fuel gauges
  • Rotary encoders
  • Pressure sensors
  • Thermistors
  • Temperature Sensors
  • Gearbox controllers
  • Vehicle emission detectors
  • Chip resistors
MATERIALS:
  • Thick film

SPECIFICATIONS


Precision and accuracy in an extensible platform.

LASER:
  • Type: Diode pumped Q-switched YAG
  • Wavelength: 532nm
  • Output Power / Pulse Width:
  • 3W / 30ns
  • 3W / 70ns (optional)
  • 6W/70ns (optional)
  • Beam positioner type: High-speed closed loop galvanometer
  • Spot Size1: 8 μm - 15 μm
  • Field size: 100 x 100 mm
  • 50 x 50 mm (8 μm spot)
  • 25 x 25 mm (8 μm optional)
  • Depth of Focus: 150 μm 50 μm (8 μm spot)
  • Beam Repeatability: ≤6.0 μm
  • Resolution: 1.52 μm - 0.80 μm (8 μm spot)
MATERIAL HANDLING:
  • Programmable Z Stage
  • Z Travel: 20mm
  • Z Resolution: 4um
  • Z Repeatability: 4um
  • Theta Travel: ± 5 degrees
  • Theta Resolution: 0.003 degrees
  • Lifting/Probe force: 25 lbs (11.3 kg)

FEATURES & OPTIONS


System Features

  • Optional Equipment:
  • Low-ohm option (5 mΩ – 1 Ω):
  • Uses standard 4T probe cards
  • Range 0.005 Ω – 0.1 Ω ±0.50%
  • Accuracy 0.1 Ω - 1 Ω ±0.25%
  • Additional matrix cards
  • Choice of analog cables
  • PCI IO card
  • GPIB interface
  • GPIB instrumentation package
  • Configurable Light Tower
  • Illumination options
  • Service tools and accessories

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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