Improve Failure Analysts to Maximize Yield

QuikLaze 50ST2 is a tool designed specifically for quick, easy removal of a variety of materials. Multiple, user-selectable wavelengths provide the capability to selectively remove specific materials while leaving others unaffected. A few examples of the procedures that can be efficiently performed using QuikLaze include:

  • Remove ITO shorts—cut metal traces on LCD panels 
  • Remove polyimide before FIB edits

The system can vastly improve yield for LCD production by quickly repairing defects and removing shorts. The QuikLaze laser system features an Advanced Beam Delivery System (ABDS). The ABDS enables precise cuts on a microscopic level for each of the three wave-length regions (infrared, visible or ultraviolet). The system also provides precise power control of the wavelength selectable beam without sacrificing the beam characteristics.


Increase your IC Design Engineers Productivity

  • LCD Repair
  • Failure Analysis
  • Micromachining
  • Material removal
  • Cutting circuit lines


Choose standard configuration or multiple options for ultimate flexibility

  • Laser head (vertical mount) with 2.5mm x 2.5mm aperture
  • XY Shutter (Std. Resolution)
  • Close-loop energy control
  • 2.4m umbilical
  • Power supply
  • Remote Control Panel
  • Foot switch
  • Video spot marker


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For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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