Why risk your production cycles with a low priced imitation? Get a Garnet.

master the six challenges of depaneling - get the guide


Built to Keep Your Production in Constant Motion

The Garnet Depaneling-20 laser platform reduces downtime by providing industry leading laser power automation for constant and consistent laser power and an innovative debris removal technology. ESI's precision engineering maximizes yield by eliminating heat affected zone burning and a patented compound beam movement technology to minimize process time. 

Increase yield, accelerate throughput and maximize panel utilization.

OVERVIEW


Improve Production Cycle Time to Meet Production Demands

CONSUMER ELECTRONICS:
  • Camera Module
  • Finger Print Sensor Module
  • Wearable PCB
DEPANELING APPLICATIONS:
  • Medical
  • Automotive
  • Consumer Electronics
  • Military
  • Industrial
MATERIALS :
  • FR4 Rigid PCB Boards
  • Flexible PCB
  • Glass Substrates
  • Ceramic
  • Soft Goods
  • Brittle Materials

SPECIFICATIONS


World Class Laser Precision for Cutting Large Format Materials

LASER:
  • Type: DSSP
  • Wavelength: 355nm
  • Pulse Rate Range: 40 KHz-300KHz (20W)
STAGE SIZE:
  • Stage: 300 x 300mm
  • Base Platform: Single fixture processing

FEATURES & OPTIONS


Engineered for Precision. Built for Production. Garnet Delivers!

  • Confidently deliver cutting accuracy on up to .8mm thick FR4 PCB
  • Guarantee precision cutting with fully automated SW control two-dimensional moving stage
  • Reduce scrapped parts with high resolution CCD image alignment
  • Maximize cut quality with automated laser power monitoring system to guarantee the laser power on the work surface
  • Increase cut accuracy with an innovative mechanical design that isolates factory floor vibration
  • Reduce maintenance cost with unique debris removal system to maintain