Enable cutting, marking, or engraving capabilities with laser micromachining tools.

get your ultimate guide to high yield laser micromachining

Transform materials faster with greater precision and accuracy.

ESI’s adaptable laser micromachining platforms provides manufactures in aerospace, automotive, electronics, medical and soft goods the flexibility to customize laser engines, optics and sample handling configurations to deliver precise results across a wide variety of materials while delivering high yields. Built on a versatile base frame the micromachining platforms are specifically targeted to allow manufactures with short timeframes and versatile production needs to win new contracts. ESI’s compound beam movement control allows accuracy in placement resulting in high yields while decreasing non-usable components and increasing profitability.  


Apply unique engineering expertise to transform large format material.

The Garnet micromachining platform is ESI’s low cost of ownership platform built in China for fast delivery to Chinese manufacturing. Optimized to deliver high volume production throughput for laser drilling on large format materials at the  highest accuracy of a mid range laser on a 300x300mm stage. The platform takes advantage of ESI’s built-in-design extendibility  for multiple lasers, optics and stage configurations to meet the short ramp time needed to build your next device.

The Garnet can be easily configured to accommodate a wide variety of laser sources with different powers, wavelengths and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.

get details on the Garnet advantage

  • Engraving
  • Cutting
  • Marking
  • Aluminum
  • Organics
  • Stainless Steel

ESI’s most powerful laser tool for PCB cutting

The Garnet Depaneling-20 is ESI’s most powerful laser tool designed for flexible and rigid PCB cutting applications.  Built in China for fast delivery to Chinese manufacturing.  Optimized for precision and high production throughput to maximize your production cycle over the market's less reliable laser tools that require frequent calibration and maintenance to remain operational in production environments. Now you can meet yield requirements, reduce overall production costs and build for future production opportunities with a single tool that is engineered to eliminate constant callibaration and built to provide consistent up time.  


get details on the Garnet Depaneling-20 advantage

  • DSSP
  • 355nm
  • 40 Khz-300KHZ (20w)
  • 300 x 300 mm
  • Single fixture processing

Let us show you how laser micromachining transforms materials beyond the limits of mechanical tools.

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