Increase Uptime and Maximize Yield

CapStoneTM + SPOT ONTM


Increase Performance for CapStone™ Flex PCB Drill System

Increase via drilling operational performance with CapStone’s SPOT ONTM feature upgrade:

  • Higher Yield by reducing common via quality issues
  • Reduced fleet and lot variability
  • Reduced downtime with spot quality measurement for improved service planning

 

Beam Location and Control

Automatically measure and validate spot size and focus during production

 

 

Panel Z Mapping

Quickly and accurately measure surface height variations across the processing surface due to chuck, overlay and the material before processing.

 

Realtime Z Control

The system will automatically compensate for z-height fluctuations during production

Discover the SPOT ONTM Advantage:

 

 

SUMMARY


Extending the CapStone's Yield Perfromance

APPLICATIONS:
  • Blind Vias
  • Through Hole Vias
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

SPECIFICATIONS


Extending the CapStone's Yield Perfromance

FOCUS CALIBRATION AND ACCURACY:
  • Automatic Calibration
  • Optical method
  • Accurate to ~10um
  • Assure Process Window is centered due to continual updating of focus calibration.
SPOT SIZE AND QUALITY :
  • Verified on a user defined basis
  • Data collected into easy-to-read SPC charts showing trends over time.
HEIGHT FLUCTUATION CONTROL:
  • System measures and retains height map on a per job basis
  • System auto-compensates during processing to maintain ideal focus position to within <30um across the work surface.

FEATURES & OPTIONS


Industry’s-first dynamic focus capability improves yield

  • Beam Location Contol
  • Panel Z-mapping
  • Real time Z contol and automate measurment of beam qaulity parameters