Leading-edge solutions for flex via drilling.
The demand for ever-smaller microvias and higher feature density in increasingly delicate flexible and rigid-flex circuits is driving increased worldwide adoption of ESI systems. Nine of the world’s top 10 flexible circuit manufacturers trust ESI with their bare board production. Among laser drilling machine manufacturers, ESI designs via drilling systems that excel in accuracy, power control, reliability, and productivity to achieve lower overall cost of ownership for applications ranging from the most simple coverlay cutting to today’s most advanced microvia drilling and circuit patterning processes. This makes ESI the clear industry choice.
FLEX INTERCONNECT PLATFORMS
High quality and high speed that translates to breakthrough productivity.
The CapStone™ system incorporates new laser technology and new laser control capabilities to deliver a high-throughput solution. CapStone addresses an evolving set of production challenges faced by leading FPC processors to enable higher levels of precision–even on thinner materials.
APPLICATIONS:
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Patterning
- Skiving
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid crystal polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT duroid)
- Coverlay (polyimide + adhesive)
The 5335 is able to handle the finest materials with optimal production speeds and quality.
The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.
APPLICATIONS:
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Patterning
- Skiving
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
RedStone Flex PCB Laser Processing System
RedStone™ delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.
APPLICATIONS:
- Flex and interconnect processing
- Blind via drilling (BHV)
- Through via drilling (THV)
- Routing
- Coverlay routing
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
Higher throughput. Industry-leading power monitoring and control. ESI quality.
Process blind and through vias, rout and skive coverlay and thin printed circuit boards at high speeds and yields using ESI’s compound beam positioning and patented Precision Pulse™ technology. With the added assurance of energy traceability and closed-loop power control that Precision Pulse™ provides, RedStone XP is a low-risk investment.
MARKETS:
- Flex PCB Laser Processing
- Rigid-Flex Laser Processing
- Laser Micromachining
MATERIALS:
- Polyimide
- Liquid Crystal Polymer (LCP)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
APPLICATIONS:
- Through via drilling (THV)
- Flex and interconnect processing
- Blind via drilling (BHV)
- Routing
- Coverlay routing
LodeStone Laser Processing System
The LodeStone™ system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.
APPLICATIONS:
- Flex and interconnect processing
- FPC depaneling
- Coverlay routing
- Touchscreen and polarizer cutting
- Through via drilling (THV)
MATERIALS:
- Polyimide (PI)
- Liquid Crystal Polymer (LCP)
- Cyclo-Olefin Polymer (COP)
- Polyethylene terephthalate (PET)
- Adhesiveless copper-clad polyimide laminates
- Copper-clad polyimide laminates with adhesive
- Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
- Coverlay (Polyimide + Adhesive)
The world is transforming. ESI is focused on delivering new and innovative micro-manufacturing solutions that empower our customers to build the products that transform lives.
"The development of this new technique provides our customers the ability to generate data across the periodic table at detection limits superior to traditional methods in a very cost effective manner."
Jon Landau, Vice President of the Geoanalytical Division, Bureau Veritas Minerals
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.
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