Resources

Garnet Data Sheet

Get detailed specifications for the Garnet micromachining platform. 

Garnet Nanosecond UV Data Sheet

Get more information about the Garnet Nanosecond UV micromachining platform. 

Lumen CO2 Data Sheet

Get more information about the Lumen CO₂ micromachining platform.

Lumen Data Sheet

Get detailed specifications for the Lumen laser micromachining platform.

Lumen IR Fiber Data Sheet

Get more information about the Lumen IR Fiber micromachining platform. 

Lumen IR Fiber QCW Data Sheet

Get more information about the Lumen IR Fiber QCW micromachining platform. 

Lumen Nanosecond UV Data Sheet

Get more information about the Lumen Nanosecond UV micromachining platform.

Lumen Picosecond Green Data Sheet

Get more information about the Lumen Picosecond Green micromachining platform.

nViant Data Sheet

Get detailed specifications for the nViant high density interconnect platform.

Rollmaster Data Sheet

Get detailed specifications for the RollMaster automation platform. 

Ultrus Data Sheet

Get detailed specifications for the Ultrus laser scribing platform.

M350 Data Sheet

Get more information about the M350 wafer trimming platform.

Garnet Depaneling-20 Data Sheet

Get detailed specifications for the Garnet Depaneling-20 micromachining platform.

HM300 Data Sheet

Get detailed specifications for the HM300 hard marking wafer system. 

SigmaDSC Data Sheet

Get detailed specifications for the SigmaDSC hard marking wafer platform.

SC300 Data Sheet

Get detailed specifications for the SC300 soft marking wafer platform.

SigmaClean Data Sheet

Get detailed specifications for the SigmaClean soft marking wafer platform.

5335 Data Sheet

Get detailed specifications of the 5335 flex interconnect platform. 

5335xi Data Sheet

Get detailed specifications for the 5335xi flex interconnect platform. 

Flex5335 Data Sheet

Get detailed specifications for the Flex5335 flex interconnect platform. 

GemStone Data Sheet

Get detailed specifications for the GemStone flex interconnect platform. 

RedStone Data Sheet

Get detailed specifications for the RedStone flex interconnect platform. 

LodeStone Data Sheet

Get detailed specifications for the LodeStone flex interconnect system. 

Allegro Data Sheet

Get detailed specifications for the Allegro MLCC testing system. 

Allegro LC Data Sheet

Get detailed specifications for the Allegro LC MLCC testing system. 

CapStone Data Sheet

Get detailed specifications for the CapStone flex interconnect platform. 

Geode Data Sheet

Get detailed specifications for the Geode high density interconnect platform.

ESI Tech Brief

Laser-based method for applying glass as a dielectric and Cu pattern carrier for PCBs. 

Material Capabilities Deck

Gaining Competitive Advantage Through Smarter Manufacturing

Learn more about gaining competitive advantage through smarter manufacturing.

Add Laser to Your PCB Processing Capabilities

Learn more about keeping current to stay competitive in flex PCB processing.

Preparing for Next Generation Precision Laser Micromachining White Paper

Learn about preparing for next generation precision laser micromachining.

Technical Guide to Engraving and Laser Passivation for Medical Technology White Paper

Learn more about engraving and laser passivation from this White Paper.

Top 5 Challenges of Laser Engraving White Paper

Beat the top 5 challenges of laser engraving.

Flex Laser Processing Backgrounder: Minimizing Cost-of-Ownership

Investigate cost-of-ownership issues related to Flex PCB laser processing. 

Laser Depaneling

Master the six challenges of laser depaneling

Keeping Current To Stay Competitive In Flex PCB Processing

Taking advantage of high-speed UV laser micromachining to stay ahead of your customers' evolving processing needs

Flex PCB Laser Processing Systems

Overview of ESI's market-leading flex PCB laser processing systems.

Build Your Next Component

See the laser processing difference.

The ESI Advantage

Decades of laser technology development applied to solving customer challenges in production.

采取外向切割组装印制电路板的复杂性

Garnet Laser Processing Platform

See laser precision and accuracy in action.

nViant System

CO2 laser system for HDI PCB manufacturing and substrate processing.

RollMaster Roll-to-Roll Handler

High-volume automation for flex material handling.

Ultrus System

High-throughput solution for semiconductor laser scribe that maintains high die-break strength and minimizes heat-affected zones.

Chalk Talks: Optimize Production with Optical Design Considerations Part 1

Chalk Talks: Optimize Production with Optical Design Considerations Part 2

Chalk Talks: Optimize Production with Optical Design Considerations Part 3

Build Your Next Component with Adaptable Laser Platforms

Customer Testimonial: Flex PCB Laser Processing Systems

PFC Flex shortens time-to-market using ESI's 5335 flex PCB laser processing systems.

ESI系列讲座

激光加工设备中的光路设计（二）

ESI系列讲座

激光加工设备中的光路设计（一）

Meet RedStone

Part of ESI's flex portfolio for through hole drilling and routing.

Wafer Processing Solutions

Leverage ultrafast high-pulse-rate lasers for precise wafer grooving and wafer marking.

Garnet SMEMA Automation

Watch the Garnet micromachining platform's automation capabilities in 45 seconds, the newest installment to the Laser Demo :45 series.