Chapter 1: Laser technology for flex processing Manufacturing flow and considerations in adopting laserprocessing capabilitiesMarket demand for smaller, faster, wearable, lighter and more powerful
MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution
[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.