The 1,000th system rolled off the manufacturing line in Singapore in March and is destined for the Vietnam production facility of the Sonova Group, based in Stäfa, Switzerland. “This will be our fifth 5335 system,” said Stephan Kaderli, Director Operations SOCS at Sonova. “As a global company that relies on global support, it’s important that we have systems we can rely on. The 5335 has proven itself over the years, and we are happy to be adding this system to our existing set of 5335s.”
“Although a majority of the work we do for them involves high-volume through-via drilling, they also have the need for us to process flex PCB’s that require blind vias. That meant that we needed a solution we could rely on to do both. After evaluating the RedStone system...
Zhen Ding Technologies (ZDT), a manufacturer of high density interconnects (HDI) and flexible printed circuit boards (PCBs), awarded our E&S division the Strategic Cooperation Partner award, recognizing unique technology in the FPC manufacturing process
“A novel process for the preparation of conductive features on glass substrates is presented. In this process, an ultrafast green laser is utilized to remove material from a transparent glass substrate, and a second laser source deposits Cu droplets through the laser-induced forward transfer of a donor film into the laser-etched features. Electroless plating methods that employ the laser-deposited Cu droplets as autocatalytic sites for plating (i.e., “seeds”) are then used to fill in the laser-etched features. Using this method, we have prepared functional printed circuit boards and transparent wire meshes on glass substrates.”
Cicor is the first European PCB company to invest in MKS’ latest-generation ESI UV laser drilling technology
[PRESS RELEASE] PORTLAND, Ore., Aug. 27, 2019 (GLOBE NEWSWIRE) -- MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a sale for the recently introduced ESI® CapStone™ printed circuit board (PCB) laser processing systems to Cicor.
MKS Instruments Receives Multiple-System Order for Recently-Released ESI Flex PCB Laser Via Drilling Solution
[PRESS RELEASE] MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced a multi-system order from Suzhou Dongshan Precision Manufacturing (DSBJ) for the recently-released ESI CapStone™ laser drilling solution for flexible printed circuits (FPC). The order—in double digit quantity—is the result of thorough system evaluation at one of DSBJ’s facilities in China.
Beyond the Photon - Dr. Zhang provides insights into the current challenges and new opportunities in PCB manufacturing. You will get an understanding of the latest applications and materials emerging to deliver the future of communication - the 5G revolution.
“Our testing and evaluation process for CapStone has been rigorous and extensive”, said Cathay Wu, director, purchasing, Material Division, Compeq. “We have processed thousands of panels over the last few months with the CapStone system. We evaluated the system on a wide range of applications and material stacks, as well as numerous via types and sizes—in both panel and roll-to-roll processes—and achieved excellent yield. CapStone showed significant increases in throughput and savings in cost-per-panel, and has met or exceeded our expectations. We look forward to leveraging CapStone for a number of applications and taking advantage of its throughput and yield to stay competitive in this very demanding market.”
How are innovators building strategic frameworks to choose lasers and analyze materials? What equipment are innovators using to process new materials to stay one step ahead? Do new end market demands require the rethinking of laser systems and architectures?
For industries facing material transformation challenges in production, we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.