Stepping Up to Laser Processing for Flex: Chapter 5

Stepping Up to Laser Processing for Flex: Chapter 5

Learn the latest tips and tricks for developing effective flexible circuit laser processes.

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Geode Expands  HDI Footprint

Geode Expands HDI Footprint

[PRESS RELEASE] PORTLAND, Ore. – July 20, 2021 – MKS Instruments, Inc. (NASDAQ: MKSI), a global provider of technologies that enable advanced processes and improve productivity, today announced confirmation of an order for the ESI® Geode™ HDI via drilling system from TTM Technologies, Inc. (“TTM”), a major technology leader in the HDI PCB manufacturing market, for their facility in Guangzhou, China. The financial terms of the order were not disclosed.

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Stepping Up to Laser Processing for Flex: Chapter 4

Stepping Up to Laser Processing for Flex: Chapter 4

Now it is time to get your new system installed and processing those first runs!

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Beyond the Photon: Long Live the Via

Beyond the Photon: Long Live the Via

Long Live the Via. In this special edition episode of Beyond the Photon, we got the opportunity to sit down with Senior Director of Product Marketing, Todd Templeton.

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Stepping Up to Laser Processing for Flex: Chapter 3

Stepping Up to Laser Processing for Flex: Chapter 3

How do you get your your facilities ready for the introduction of laser processing?

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Stepping Up to Laser Processing for Flex: Chapter 2

Stepping Up to Laser Processing for Flex: Chapter 2

When it comes to laser processing for flex PCB, how do you calculate and optimize total system cost of ownership (TCO) and cost per panel (CPP)?

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Stepping Up to Laser Processing for Flex: Chapter 1

Stepping Up to Laser Processing for Flex: Chapter 1

Chapter 1: Laser technology for flex processing Manufacturing flow and considerations in adopting laserprocessing capabilitiesMarket demand for smaller, faster, wearable, lighter and more powerful

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Gallery of Vias

Gallery of Vias

Welcome to the Gallery of Vias

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Beyond the Photon: HDI Episode

Beyond the Photon: HDI Episode

Check out the latest Beyond the Photon episode as we have an insightful discussion on the latest trends in via drilling for HDI PCB manufacturing and integrated circuit packaging

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Capstone Sees Strong Market Demand

Capstone Sees Strong Market Demand

[PRESS RELEASE] “CapStone has definitely been a game changer,” said John Williams, Vice President and General Manager of MKS’ Equipment and Solutions division. “As Flex PCB manufacturers continue to upgrade their processing capabilities to address new technologies such as 5G, the CapStone system is enabling them to take advantage of latest-generation laser technology to stay current in a very competitive market.”

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Intra-pulse beam steering for High-Density-Interconnect via drilling

Intra-pulse beam steering for High-Density-Interconnect via drilling

Intra-pulse beam steering for High-Density-Interconnect via drilling by Jan Kleinert - Research Director at ESI, a Division of MKS Inc.

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MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution

MKS Sees Strong Early Market Adoption in Asia for its Newest HDI PCB Laser Manufacturing Solution

[Press Release] According to Atsushi Sakate, Executive Officer, General Manager of Production at Meiko, “Beyond the Geode system’s higher drilling throughput and accuracy, the system’s smaller footprint and lighter weight enables us to plan capacity expansion with much more flexibility. Add to this the broad range of applications and materials that Geode can process, and the decision is clear.” READ FULL RELEASE

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For industries facing material transformation challenges in production,  we apply unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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