Affordable versatility in a CO2 laser solution for HDI via drilling. Leverage ESI’s laser expertise for PCB and substrate processing.

Affordable versatility in CO2 laser via drilling for HDI applications.

Whether processing PCBs or substrate, NViant enables PCB manufacturers to include rigid HDI processing services to their customers, as part of a broader portfolio of services and at a lower cost of ownership, while leveraging the experience of a laser systems provider that has a demonstrated history of applied laser expertise.

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Affordable versatility in CO2 laser via drilling for HDI applications.

nViant provides a CO2-based laser microvia drilling solution with a unique combination of high-quality via formation and high-accuracy, in a robust via drilling system that delivers high-volume laser processing throughput at a competitive price point. Maintain your PCB laser processing production throughput for HDI applications without sacrificing quality or accuracy.

The nViant via drilling system precisely drills blind (BHV) and through-hole vias (LTH) in coppercladded, glass woven reinforced materials (FR-4) at a typical range of 40 to 300µm, and enables pcb laser processing customers to Include rigid HDI processing as part of a broader portfolio of services and at a lower cost of ownership, while leveraging the experience of a laser systems provider that has a demonstrated history of applied laser expertise.

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APPLICATIONS:
  • HDI PCB via drilling
  • Substrate Processing
MATERIALS:
  • FR4
  • BT
  • ABF
  • PTFE

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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