Improve your routing accuracy and minimize heat-affected zones.


Precision routing with proven ESI UV laser technology.

Choose from the ESI flex processing system portfolio to optimize around your routing requirements. Various laser options and levels of system capabilities allow you to find the right balance between cost and quality.

With increasing flex circuit design complexity, shrinking circuit sizes, and increasing pace of development, many PCB processors are shifting from mechanical routing and punching processes to laser routing processes. Not only do laser processes allow for more intricate patterns to be processed, but also do so with zero mechanical stress and high accuracy.

Rout materials ranging from coverlay, flex circuits, and even thin (<500um) glass-reinforced circuits with minimal carbonization and high productivity.

Materials

  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesive-less copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)
  • Other unclad flex circuit materials

ROUTING PRODUCTS


RedStone Flex PCB Laser Processing System

RedStone delivers a robust solution to through via and routing applications for a wide variety of flex manufacturing needs. With the same accuracy, sturdy frame, and software functionalities as ESI’s other flex drilling systems, RedStone offers an ideal entry point for customers new to flex drilling.

learn more about RedStone

APPLICATIONS:
  • Flex and interconnect processing
  • Through via drilling (THV)
  • Routing
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

The Flex5335 processes the thinnest flex materials with high precision.

The Flex5335 shares technology and application advantages with the rest of the 5335 family of FPC laser processing systems. It differentiates itself by incorporating proven UV laser technology with the versatility of beam shaping technology to allow manufacturers to more precisely and efficiently process unclad organic materials.

learn more about Flex5335

APPLICATIONS:
  • Coverlay routing
  • Solder-mask opening
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Coverlay (Polyimide + Adhesive)
  • Other unclad flex circuit materials
  • Solder mask

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

See what it's like to be an ESI customer - contact an ESI Sales Expert today