High definition and depth control for production processes.


High definition and depth control for production processes.

Patterning is a generic term that – for laser processing – can be defined as the bulk removal of one or more layers of material in a given pattern. ESI’s laser processing tools have been used for a wide set of patterning applications including:

  • Removing top copper off of FR-4 boards prior to cleaning the dielectric with a CO2 laser tool
  • Removing coverlay or Kapton/polyimide off of capture pads
  • Marking 2D barcodes and identification text onto panels for tracking purposes
  • Exposing internal-layer registration fiducials by removing top layers of multi-layer boards
  • Scribing fine patterns in conductive layers

ESI’s laser processing systems enable an unparalleled level of accuracy, crisp resolution, quality and yield at high productivity.

Proprietary beam positioning and beam shaping technology allow high-resolution features to be processed at high throughput. High repetition rate lasers focused to small spot sizes further benefit productivity and razor-sharp feature definition. ESI’s unparalleled power control technologies avoid bottom layer damage. Precision-engineered systems with robust automated alignment mechanisms enable excellent dimensional accuracies and feature registration.

Materials

  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Coverlay (Polyimide + Adhesive)
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Other unclad flex circuit materials
  • Solder mask

 

PATTERNING PRODUCTS


LodeStone Laser Processing System

The LodeStone system is a more accurate and flexible processing alternative for the efficient cutting and drilling of flexible materials. Its short pulse-width femtosecond laser results in low levels of carbonization and minimal heat affected zones, delivering the exceptional accuracy and tight tolerances required by processors driving new solutions to market.

learn more about LodeStone

APPLICATIONS:
  • Flex and interconnect processing
  • FPC depaneling
  • Coverlay routing
  • Touchscreen and polarizer cutting
  • Through via drilling (THV)
MATERIALS:
  • Polyimide (PI)
  • Liquid Crystal Polymer (LCP)
  • Cyclo-Olefin Polymer (COP)
  • Polyethylene terephthalate (PET)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

The 5335 is able to handle the finest materials with optimal production speeds and quality.

The 5335 is a perfect flex PCB laser processing solution for leading-edge flex circuit manufacturing customers. Now in service at the top 10 flex PCB manufacturing companies, the 5335 laser via drilling machine is a good fit for customers requiring production-oriented flex PCB via drilling for PCB laser processing. It is also a good fit for general micromachining customers looking to take advantage of the state-of-the-art laser processing technology and applied laser expertise built into the 5335 platform.

 

learn more about 5335

APPLICATIONS:
  • Blind via drilling (BHV)
  • Through via drilling (THV)
  • Routing
  • Patterning
  • Skiving
  • Coverlay routing
MATERIALS:
  • Polyimide
  • Liquid Crystal Polymer (LCP)
  • Adhesiveless copper-clad polyimide laminates
  • Copper-clad polyimide laminates with adhesive
  • Glass-reinforced laminates (e.g. FR-4, BT, RT Duroid)
  • Coverlay (Polyimide + Adhesive)

For industries facing material transformation challenges in production,  ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.

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