What if you could cost effectively laser cut in high volumes and reduce damage through heat affected zones?

Ultra fast throughput, cost-efficient laser cutting.

ESI’s Laser micromachining platforms provide a contamination-free, high yield, cost- effective cutting solution for today’s smaller, densely packed consumer electronics and medical devices. As devices become smaller, mechanical cutting systems are no longer feasible. The trend toward miniaturization is driving printed circuit designers and manufacturers to place multiple devices on larger panels to help improve manufacturing throughput and device performance. Before these devices can be used they must be first cut out of the larger panels, or “depaneled.” The ESI laser cutting machines provides a cost-effective, non-contact method for depaneling both rigid boards and flexible circuits.

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CUTTING SYSTEMS


Apply engineering expertise to transform unique materials.

Lumen is the most flexible cross-industry laser micromachining platform available on the market today. Its base module can accept a broad range of laser engines spanning the pulse width and wavelength spectrum. The control software exposes only those process parameters relevant to the selected laser cutting configuration fast and easy. 

get details on the Lumen advantage

APPLICATIONS:
  • Laser Cutting
  • PCB Depaneling
MATERIALS:
  • Metals
  • Organics
  • Assembled PCBs

Apply unique engineering expertise to transform small format materials.

Jade focuses on delivering consistently high yields in high-volume production environments for materials no larger than 2.75”x5”.

The Jade micromachining platform is optimized to deliver exceptional reliability and throughput for laser drilling at a low cost of ownership. 

get details on the Jade advantage

APPLICATIONS:
  • Engraving
  • Cutting
  • Marking
MATERIALS:
  • Aluminum
  • Organics
  • Stainless Steel

Apply unique engineering expertise to transform large format material.

The Garnet micromachining platform is ESI’s low cost of ownership platform built in China for fast delivery to Chinese manufacturing. Optimized to deliver high volume production throughput for laser drilling on large format materials at the  highest accuracy of a mid range laser on a 300x300mm stage. The platform takes advantage of ESI’s built-in-design extendibility  for multiple lasers, optics and stage configurations to meet the short ramp time needed to build your next device.

The Garnet can be easily configured to accommodate a wide variety of laser sources with different powers, wavelengths and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. An ESI-proprietary real-time control system synchronizes the timing of laser pulses with laser beam positioning and movement of the work surface.

get details on the Garnet advantage

APPLICATIONS:
  • Engraving
  • Cutting
  • Marking
MATERIALS:
  • Aluminum
  • Organics
  • Stainless Steel

Let us show you how laser processing transforms materials beyond the limits of traditional tools to maximize your results.

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