Via drilling solutions to meet the evolving challenges faced in flexible PCB fabrication.
As a leading provider of flex laser via drilling solutions, ESI applies decades of innovation and laser processing expertise to the challenges faced by customers focused on optimizing their production capabilities and lowering production costs. Our family of flex solutions are purposefully engineered to deliver the combination of speed, accuracy and performance our customers need to meet the evolving challenges of a more mobile and connected world. Our market leadership and focus on quality, reliability and low cost-of-ownership extends across the entire via drilling systems portfolio. It’s no coincidence that the world’s top flexible circuit manufacturers trust ESI with their production.
Flex PCB Processing Applications
ESI's flex PCB laser processing systems excel in accuracy, power control, reliability and productivity. We help our customers achieve higher quality production output with higher yields and lower overall cost of ownership. For applications ranging from simple coverlay cutting to advanced high-speed blind via drilling and circuit patterning processes, ESI’s flex systems are the solution of choice among the top PCB manufacturers worldwide.
Flex PCB Automation Applications
Maintain high-volume manufacturing with flex PCB materials.
RollMaster™ by Northfield Automation extracts maximum performance out of your ESI flexible circuit laser drilling tools. Blaze through material using ESI Model 5335’s maximum 1.5G stage acceleration with the RollMaster’s proprietary lightweight dancer design. Reduce your cycle time with RollMaster’s high-speed web indexing.
As the recognized leader in flex PCB processing, we have decades of applied expertise in laser via drilling and production-oriented Flex PCB laser processing. Learn more about our portfolio of laser via drilling systems and see how you can incorporate flex PCB laser processing to help address flex PCB manufacturing challenges.