Experience Precision in Motion at CPCA and SEMICON China
ESI will be attending, the China International PCB and Assembly Show and SEMICON China, two of the world’s leading trade events in China demonstrating our latest tool platforms within our channel partner booths. This is an opportunity for our current customers and prospective customers to visit our booths, speak with our product experts and see the tools in action at the show.
March 7-9, 2017
National Exhibition and Convention Center
Demonstrating Redstone flex drilling tool
RedStone is part of ESI's market leading flex family. Designed to optimize through via-drilling and FPC routing with the right combination of laser, accuracy and control-capabilities.
Demonstrating nViant HDI laser processing system
nViant laser processing system is engineered for precision and affordable versatility in high production CO2 via drilling delivering ongoing innovation in HDI.
Pioneered UV laser processing for flex PCB
Introducing the newest member of ESI's flex portfolio for through hole drilling and routing.
March 14-16, 2017
Shanghai New International Expo Center
Demonstrating Ultrus laser scribing platform
Ultrafast, high pulse-rate-laser technology for precise wafer grooving.
Demonstrating SC300 wafer marking system
Proprietary super softmark technology and patented diode-pumped laser, delivers precise debris-free soft marking.
Optimize production capabilities with wafer processing solutions
Leverage ultrafast high-pulse-rate lasers for precise wafer grooving and wafer marking.
For industries facing material transformation challenges in production, ESI applies unique process and engineering expertise to deliver a set of laser-based solutions that extend our customers’ processing capabilities beyond the limitations of mechanical.