Wafer Dicing

The ESI 9900 is the first production-ready, fully automated wafer dicing system that uses proprietary, laser-based technology to quickly and efficiently dice ultra-thin wafers (<50 microns). The 9900 reliably yields die that can withstand the rigors of advanced packaging requirements.

Revolutionizing the industry with proprietary, laser-based architecture

ESI’s 9900 system is revolutionary for the semiconductor industry as it enables our customers to fully adopt 3D integration into their high volume manufacturing environments. Optimized for high precision and speed