Semiconductor

FPD Repair & Failure Analysis

Laser Fuse Processing

Laser Trimming

   M350
   LT2200
   LT2210
   LT3100
   LT3110

WaferMark

Laser Scribing/Grooving

   Ultrus
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High-volume wafer scribing solution

Maintain high die-break-strength and apply smaller heat-effected zones with the Ultrus high-volume semiconductor scribing/grooving solution. Ultrus allows semiconductor manufacturers to process a wide range of current and new materials without damaging the underlying device.

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