Build what’s next with the laser platform designed to deliver competitive advantage

Jade is a new and highly extendable platform with the power to cut, drill, mark and engrave a broad spectrum of materials. Lower your cost of ownership, maximize your yield and build what’s next. learn more >

Market demand is driving the need for flex PCB processing… Are you ready?

Don’t be outpaced by competitors because you haven’t kept your processing capabilities up to date. Start to get a clearer picture of FPCB processing trends and drivers in this short “Keeping Current” overview designed to help prepare you to meet the increasing demand for flex PCB processing.

Get it to go

From wearables to automobiles to phones and tablets, ESI laser marking and drilling systems open up a world of design possibilities that help your products stand out from the crowd.

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Corner the market

Our new CornerStone UV laser drilling system enables IC packaging manufacturers to meet today’s design requirements and prepare for the smaller vias and higher accuracy of the future.

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Discover other worlds

Laser ablation systems from ESI — among the most popular in the industry — are allowing scientists to learn more about the world around us.

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ESI provides innovative, laser-based manufacturing solutions for the microtechnology industry

At ESI, we create applications using laser light to alter materials in ways that make possible the formerly impossible. We help industrial designers and process engineers to differentiate their consumer electronics, wearable devices and circuits, enable technology development engineers and scientists to push the limits of what’s possible, and help all our customers gain competitive market advantage. Our laser-based manufacturing solutions offer the highest precision and speed in the microtechnology industry so that visionaries at all levels of your organization can imagine, build and profitably deliver the technologies of the future.