PFC Flexible Circuits realizes significant gains
in HDI Flex Circuit manufacturing performance

PFC chose the Model 5335 Laser Processing System to increase their drilling throughput while saving floor space, and gained a technological edge in the process. “Now, with the addition of the Model 5335, we can support true high density interconnect flex technologies. This laser processing system from ESI will allow us to make smaller vias, blind and buried vias, and to cut smaller features in HDI circuits.”
— Steve Kelly, President, PFC Flexible Circuits 
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Get it to go

From wearables to automobiles to phones and tablets, ESI laser marking and drilling systems open up a world of design possibilities that help your products stand out from the crowd.

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Corner the market

Our new CornerStone UV laser drilling system enables IC packaging manufacturers to meet today’s design requirements and prepare for the smaller vias and higher accuracy of the future.

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Discover other worlds

Laser ablation systems from ESI — among the most popular in the industry — are allowing scientists to learn more about the world around us.

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ESI provides innovative, laser-based manufacturing solutions for the microtechnology industry

At ESI, we create applications using laser light to alter materials in ways that make possible the formerly impossible. We help industrial designers and process engineers to differentiate their consumer electronics, wearable devices and circuits, enable technology development engineers and scientists to push the limits of what’s possible, and help all our customers gain competitive market advantage. Our laser-based manufacturing solutions offer the highest precision and speed in the microtechnology industry so that visionaries at all levels of your organization can imagine, build and profitably deliver the technologies of the future.